Strong academic track record, involved multiple projects supported by IeMRC and EPSRC, previous works demonstrated great impact to the industry.
Novel materials and processes for fine pitch interconnections and reliability study
Point of Care testing (POCT) system integration and miniaturisation
Waveguide integration on flexible substrates
Copper wire bonding for ultra fine pitch interconnects
High compact and robust optoelectronics assembly
Hologan free PCB manufacture
Lead free solders and whiskers
Solar modules integrations
Seeking appropriate industrial partnerss
POCT will make a step change for future health monitoring.
Materials and novel manufacturing are highly demoanded for today's main stream device integration and enabling multifunctional approaches.
Lead free and hologan free will have significant impact moveing towards greener electronics.
Copper wire bonding provide higher performance and low cost interconnect solutions
Dr. Changqing Liu; Senior Lecturer