Thursday, May 17, 2012

STFC - Tender Opportunities

Highlights:

Latest STFC Tender Opportunities

 

This page contains details of the tenders released by STFC for various large instruments and technology projects.

Each entry will have when the documents were released and the available details for the tender.

Users are advised to check the submission dates carefully as these vary for each tender.

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CERN Price Enquiry for the supply of Oxygen-Free Electronic Copper Shunts - CERN has released a price enquiry for the supply of Oxygen-Free Electronic Copper Shunts. Below is a technical brief of the requirements for the Shunt. By Ashley Evans (25/01/12) ... more
ESRF CFT 1991: "Polished silicon blanks for grating monochromator" - The European Synchrotron Radiation Facility (ESRF) has released a contract tender for polished silicon blanks for subsequent grating manufacture to be integrated into a grating monochromator. By STFC Tenders (13/01/12) ... more
ESRF CFT 1992: "Five X-ray mirrors" - The European Synchrotron Radiation Facility (ESRF) has released a tender for 5 X-Ray Mirrors By STFC Tenders (13/01/12) ... more
CERN Tender Opportunity - Supply of 10 X-band high power loads - This enquiry concerns the precision machining, packaging and mechanical control of the X-band high power loads, the CAD drawings of which will be provided by CERN. By Ashley Evans (12/01/12) ... more
General Manufacturing of Stepper Motor Control Electronics - tender opportunity - The European Synchrotron Radiation Facility (ESRF) wishes to place a Frame Contract for the supply of Stepper Motor Control Electronics: "IcePAP”, to cover its requirements arising during the period 2012-2015. By STFC Tenders (09/12/11) ... more
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CERN Price Enquiry for the supply of Oxygen-Free Electronic Copper Shunts
by Ashley Evans (25 January 2012)
CERN has released a price enquiry for the supply of Oxygen-Free Electronic Copper Shunts.
Below is a technical brief of the requirements for the Shunt.
Technical Brief
“The shunt is the core element of the LHC machine consolidation plan. Its function is to ensure, in all operation conditions, the electrical continuity of the bus bar copper stabiliser in the 13 kA splices in order to avoid local high electrical resistance.
The main features of the shunt are:
• Rectangular shape 15 x 50 mm, 3 mm thickness;
• Rounded edges to avoid or at least reduce tendency to arc ignition at sharp edges;
• One hole for a pilot temperature probe to steer the temperature cycle;
• 3 venting holes and transverse/longitudinal grooves at the back side to facilitate flow of solder on the entire contact surface. Absence of burrs to assure an appropriate flow of the solder;
• Pick-up holes for electrical resistance measurements;
• 2 holes of ? 7 mm for filler material (Sn60Pb40 solder pellet The solder pellets should be inserted through the side of the piece without grooves;
• Surface roughness «as rolled plate» (roughness 0.25µm);
• RRR=300. The shunt shall be annealed at 400 °C for 2 hours in the end of the manufacturing process to maximize RRR.”

If you are interested in this project, please contact Jihan at tenderopportunities@stfc.ac.uk with your full contact details and address ASAP.
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