Wednesday, June 19, 2013

News

Highlights:


myAccount	myCompany	Publish An Article	Download Documents	Publish Tech Offer	Publish Tech Request

Intertronics Potting Compound goes under the sledge hammer at Tough Tracker - Intertronics potting compound IRS 3071 is waterproof, impact and thermally resistant and protects the electronics in the Tough Tracker electronic tracking device. By Peter Swanson (13/06/13) ... more

New from Intertronics – Liquidyn P-Jet CT High Performance Micro-Dispensing Valve - The new Liquidyn P-Jet CT Jetting Valve from Intertronics for high performance micro-dispensing of materials such as oils, greases, adhesives, silicones, paints, flux, pharmaceutical media and other chemicals, including filled fluids. By Peter Swanson (28/05/13) ... more

New Innovative Electrically Conductive Adhesive from Intertronics - Polytec EC 275 is a high performance electrically conductive adhesive from Intertronics with a two component formulation for applications in electronics, micro-electronics, opto-electronics, hybrids and sensor technology. Also available as premixed and frozen in syringes. By Peter Swanson (14/05/13) ... more

Intertronics offer pin point precision with P-Dot electro-pneumatic Jetting Valve - The P-Dot valve from Intertronics offers precise non-contact micro dot dispensing and can dispense dots, beads and lines of medium to high viscous chemicals, as well as filled products, with the size of the dispensing droplets adjustable from 0.3mm to 5mm in diameter. By Peter Swanson (30/04/13) ... more

Automated Root Cause Analysis - Spin-out from University of Warwick finds and resolves the root cause of faults in electronics manufacturing. The Company has been awarded a TSB grant and is looking for commercial partners to assist with commercial development of an Early Warning and Prevention System. By Dan Somers (22/04/13) ... more

Hamamatsu Linear CMOS Image Sensor with Active Pixel Sensor Technology and Direct UV Sensitivity - Hamamatsu Photonics are proud to introduce the S11638 CMOS linear image sensor with APS (Active Pixel Sensor) technology. APS technology allows the S11638 to achieve a combination of a very high sensitivity, at 160 V/(lx•s), and a fast video data rate of 10 MHz. By Craige Palmer (18/04/13) ... more

Electrically Conductive Polyurethane Adhesive - Polytec PU 1000 from Intertronics - Adhesives specialists Intertronics are delighted to announce availability of Polytec PU 1000, an electrically conductive polyurethane which addresses applications in die attach, bonding of components in hybrid circuit applications and surface mount technology (SMT). By Peter Swanson (12/04/13) ... more

New Increased Sensitivity Thumb-Sized MOEMS Mini-Spectrometer for Visible Light Spectrometry - Building on the success of the original C10988MA, Hamamatsu Photonics introduce the new C10988MA-01, offering greatly increased sensitivity. At the peak sensitivity of 450nm, the C10988MA-01 offers an increase in sensitivity of over 70% compared to the previous version. By Craige Palmer (26/03/13) ... more

UV & LED Curing Adhesive from Intertronics bonds glass to glass and glass to metal - Dymax Ultra Light-Weld® 431 from adhesives specialists Intertronics is a versatile glass-to-glass and glass-to-metal bonding adhesive which bonds rapidly upon exposure to UV/Visible light for immediate use in the assembly process, making it highly suitable for assembly applications such as furniture, container glass and lighting and appliance sub-assemblies. By Peter Swanson (21/03/13) ... more

World's first electric kit car comes to the Midlands - Electric cars are becoming more familiar on our streets. But what about one you can build yourself and race at 130 miles per hour, or more? By Ashley Evans (12/03/13) ... more

TOWARDS ZERO DEFECTS - SMART Group 2012 European Conference and Exhibition 18th-19th September

by Nigel Burtt (21 June 2012)

SMART Group Annual European Conference on Packaging, Assembly and Reliability plus Table Top Exhibition
18-19th September, Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, England, UK

This year we are concentrating on design, production and reliability of electronic assemblies with particular emphasis on new components and assembly technologies. If your goal is 0% rework and 0% field failures, then this exciting 2 day conference and at excellent new venue is for you! We have a superb programme with speakers from the UK, mainland Europe and the USA.

The proposed schedule of speakers and technical presentations is as follows:

DAY 1

Keynote Presentation: Printed Circuit Boards to Printed Electronics - The Future: Steve Jones - Printed Electronics Ltd

Thermal Cycle Solder Joint Integrity of BGA Connectors for High Performance Products: Dave Hillman -Rockwell Collins

Electronics Design for Vibration: Andy Stiles - Aero Engine Controls

SMART HALT: Bob Page – Reliability Plus

Assembling HDI PCB Designs - Real World Experiences From the Coal Face: Gareth Beckett - Axiom Manufacturing Services

High Reliability Board Fabrication and IPC-A-600 Class 3: Wim Perdu - Advanced Circuit Boards NV

Miniaturization - Solder Paste Attributes for Maximizing the Print & Reflow Manufacturing Process Window: Karthik Vijay - Indium

Stencil Technology - State of the Art: Lucian Ripperger - Christian Koenen

Discussions Forum - "Counterfeit Components" and "Where to Next for Electronics?": Graham Naisbitt - SMART Group

DAY 2

DFM – Why Can’t People Communicate?!: Sue Knight - STI Ltd

A Practical View on the Introduction of Package On Package Assembly: Bob Willis - EPS

Cleaning Under Low Stand-off Components: Rob Murphy - Zestron

Assessment of Reterminated RoHS Components for Sn-Pb Applications: Chris Hunt/Martin Wickham - NPL

Lessons Learned - Aqueous-Based Conformal Coating: Doug Pauls - Rockwell Collins

Lead-free Paste Characterization (Wetting & Voiding) vs Reliability: Joerg Trodler - Heraeus

DfM and DfR - Their Application for Hi-Rel Electronics Manufacture: Charles Cawthorne - MBDA(UK)

ESD Control in Automated Assembly and Handling Systems: Jeremy Smallwood - Electrostatic Solutions Ltd

The Last Will and Testament of the Lead-free BGA Void: Dave Hillman -Rockwell Collins

Web Site:CONFERENCE FLYER AND BOOKING FORM•EXHIBITION SPACE BOOKING FORM•SMART Group home webpage

Resources: